Felder Solder Wire ISO-Core "Clear" Sn100Ni+ Sn99,3CuNiGe 0.5mm 0.1kg

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyThe alloy Sn99Cu1(NiGe), is about a so-called eutectic alloy. Eutectic alloys dispose of a lower melting point than the constituent pure substances and melt and solidify respectively just as a pure substance at a fixed temperature.Eutectic alloys have a melting point which is easy to determine. At the same time, this melting point is the lowest of all mixtures of the same components. Mixtures with other proportions of alloying elements, however, have a melting and solidifying range in which apart from the melting there is also a solid phase.In eutectics all components solidify at the same time. As this happens at a much lower temperatrue than it would be the case with the pure components, a fine and uniform structure is created (lattice).FELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.Felder GMBH produces all NiGe-alloys with the license for the Fuji-patents:DE-patent-No. 19816671C2US-patent-No 6.179.935B1Japan-patent-No. 3296289